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CMP PROCESS CFD

CFD of CMP Processes

We analyze unsteady multiphase flow and slurry distribution around the wafer in a 300 mm CMP system as rotation speed and slurry flow rate vary.

An et al., IJPEM (2026), Fig. 6(a): time-averaged slurry film thickness for the P67/H67/Q350 case. DOI: 10.1007/s12541-026-01524-6.
An et al., IJPEM (2026), Fig. 6(a): time-averaged slurry film thickness for the P67/H67/Q350 case. DOI: 10.1007/s12541-026-01524-6.

We use CFD to examine how slurry flows over the polishing pad and enters the wafer–pad gap during chemical mechanical polishing (CMP).

Slurry transport in a 300 mm CMP system

Our 2026 study analyzes unsteady multiphase flow as pad and head rotation speeds and slurry flow rate vary. It examines film thickness and flow paths over the rotating pad, as well as slurry distribution, velocity, pressure, and wall shear stress in the wafer–pad gap.

The study investigates spatial correlations between slurry distribution and experimentally measured material removal rate (MRR), connecting flow analysis with a process-performance metric.

Paper title, abstract, and authors · DOI / publisher record · Doyun An’s research

Other applications: Flow and safety in hydrogen systems

We study hydrogen release and dispersion, inert-gas purging, pressure losses in flame arresters, and discharge flow and noise in positive-displacement compressors.

Other applications: Waves and energy transfer

Our 2026 Applied Optics paper uses complex-frequency resonance poles to interpret electric-field localization and heat redistribution in metal–polymer cavities. Published work also addresses ultrasonic transmission under dry-contact conditions.

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